KE-3020V Flex Placer KE-3010

Transcription

1 KE-3020V Our modular productio lie sets ew stadards for productivity, flexibility ad reliability

2 _20V_JASEU_EN_02.pdf :30:04 From high-speed, high-accuracy moutig dow to very small parts ultraflexible performace assures the best retur o ivestmet for ay applicatio Flexible board size The ad KE-3020V XL-size accepts larger size boards up to 610 x 560 mm. XL-size ((610 x 560 mm) Placemet head multi-ozzle laser head (6 Nozzles) Placemet rate (max.): 8,500 cph laser ceterig (IPC 9850) 18,500 9,000 cph visio ceterig (MNVC) Compoet rage: x 33.5 mm Compoet height (max.): 12 mm Placemet accuracy: ±50 µm (Cpk 1) laser ceterig ±40 µm visio ceterig (MNVC) Board dimesio (max.): 0 x 560 mm x 560 mm (with log board optio) C L-Wide size (510 x 360 mm) L-size (410 x 360 mm) mm Visio ceterig techology Feeder compatibility The ad KE-3020V is compatible with mechaical ad electroic feeders. Mechaical ad electrical feeder trolleys are completely iterchageable Exchage trolley for electroical feeder allowig compaies with previous geeratios of mechaical feeders to cotiue to get the most from their ivestmet. Exchage trolley for mechaical feeder High-precisio head or MNVC (Multi-Nozzle Visio Ceterig) optio Ceterig method ca be selected based o compoet type, shape, size ad material. Laser ceterig is used for high-speed placemet of smaller compoets.visio is used whe lead or back light ball ispectio is eeded or whe the ad side ad side recogitio compoet is too large for the laser. May ozzles are available for oddshaped compoets providig usurpassed compoet hadlig. ozzles for odd-shaped compoets Laser ceterig techology Easy operatio JUKI s LNC60 laser sesor for high-speed & high quality placemet Operator s setup checklist visio recogitio The fuctio assists operators i the preparatio of a ew productio. By simply followig a checklist of setup items 1. Automatic width adjustmet to 8. Productio program check, a operator ca be sure they have performed the ecessary steps ad see which have ot bee completed. The LNC60 laser sesor has the uique ability to ceter compoets from to 33.5 x 33.5 mm. From ultra-small, ultra-thi, chip-shaped parts to small QFPs, CSPs, BGAs, a wide rage of parts ca be precisely cetered by the laser recogitio system at high-speed. M Y CM MY Automatic compoet measuremet CY Compoet check fuctio improves placemet reliability CMY Sice the laser is mouted o the head, it ca be used to moitor the presece of compoets the etire time from pick to placemet. This is difficult to accomplish with vacuum detectio oly. The placemet reliability is also improved because the release of the compoet is cofirmed after placemet. K KE-3020V Placemet head: multi-ozzle laser head (6 ozzles) high-precisio head (1 ozzle) Placemet rate (max.): 17,100 cph laser ceterig (IPC 9850) 2,400 cph visio ceterig 9,470 cph visio ceterig (MNVC) Compoet rage: x 74 mm or 50 x 150 mm Compoet height (max.): 25 mm Placemet accuracy: ±50 µm (Cpk 1) laser ceterig ±30 µm visio ceterig Borad dimesio (max.): 610 x 560 mm 800 x 560 mm (with log board optio) Compoet data ca be programmed simply by typig approximate dimesios, type ad packagig iformatio. Accurate dimesios, umbers of leads ad lead pitch are measured ad programmed automatically by the machie. LNC60 Compoet release cofirmed after placemet. Tombstoe pick easily detected. Complicated programmig of odd-shaped compoets is made easier by followig step-by-step guidelies, reducig programmig sigificatly. High precisio ad quality with electroic feeders Electroic tape feeders (ETF series) Presece of compoet is moitored util just before placemet. Flexible visio teachig A motor-drive electroic feeder capable of feedig compoets reliability ad quickly. Simple settig of feeder pitch No tools are required to chage the feeder pitch. A cocept i compoet ceterig that is capable of o-the-fly ceterig of 6 compoets simultaeously. Optical source Ceter of rotatio Light-sesitive elemet Tagetial Lie Ceterig achieves both a wider compoet rage ad higher accuracy all at the same time.the LNC60 accurately measures the compoet s ceter, dimesios, ad agular correctio all i a sigle sweep.the optical desig has bee simplified to give higher reliability i a thier ad lighter package. Status is show o a LED display Before productio, electroic feeders commuicate with the mouter to verify cosistecy with the productio program: type of feeder ad feed pitch. Should there be ay discrepacy, the LED display flashes a warig.the LED display also alerts the operator of wrog feeder positio ad whe compoets are ruig low. Durig productio, the LED display shows the feederpositio. Automatic correctio of pick positio o feeder The variace of the positio from the ceter of each compoet is detected by the machie head whe ceterig.this iformatio is trasmitted to each electroic feeder.the feeder automatically adjusts the pick positio to icrease the chace of simultaeous pickig.

3 _20V_JASEU_EN_02.pdf :30:04 From high-speed, high-accuracy moutig dow to very small parts ultraflexible performace assures the best retur o ivestmet for ay applicatio Flexible board size The ad KE-3020V XL-size accepts larger size boards up to 610 x 560 mm. XL-size ((610 x 560 mm) Placemet head multi-ozzle laser head (6 Nozzles) Placemet rate (max.): 8,500 cph laser ceterig (IPC 9850) 18,500 9,000 cph visio ceterig (MNVC) Compoet rage: x 33.5 mm Compoet height (max.): 12 mm Placemet accuracy: ±50 µm (Cpk 1) laser ceterig ±40 µm visio ceterig (MNVC) Board dimesio (max.): 0 x 560 mm x 560 mm (with log board optio) C L-Wide size (510 x 360 mm) L-size (410 x 360 mm) mm Visio ceterig techology Feeder compatibility The ad KE-3020V is compatible with mechaical ad electroic feeders. Mechaical ad electrical feeder trolleys are completely iterchageable Exchage trolley for electroical feeder allowig compaies with previous geeratios of mechaical feeders to cotiue to get the most from their ivestmet. Exchage trolley for mechaical feeder High-precisio head or MNVC (Multi-Nozzle Visio Ceterig) optio Ceterig method ca be selected based o compoet type, shape, size ad material. Laser ceterig is used for high-speed placemet of smaller compoets.visio is used whe lead or back light ball ispectio is eeded or whe the ad side ad side recogitio compoet is too large for the laser. May ozzles are available for oddshaped compoets providig usurpassed compoet hadlig. ozzles for odd-shaped compoets Laser ceterig techology Easy operatio JUKI s LNC60 laser sesor for high-speed & high quality placemet Operator s setup checklist visio recogitio The fuctio assists operators i the preparatio of a ew productio. By simply followig a checklist of setup items 1. Automatic width adjustmet to 8. Productio program check, a operator ca be sure they have performed the ecessary steps ad see which have ot bee completed. The LNC60 laser sesor has the uique ability to ceter compoets from to 33.5 x 33.5 mm. From ultra-small, ultra-thi, chip-shaped parts to small QFPs, CSPs, BGAs, a wide rage of parts ca be precisely cetered by the laser recogitio system at high-speed. M Y CM MY Automatic compoet measuremet CY Compoet check fuctio improves placemet reliability CMY Sice the laser is mouted o the head, it ca be used to moitor the presece of compoets the etire time from pick to placemet. This is difficult to accomplish with vacuum detectio oly. The placemet reliability is also improved because the release of the compoet is cofirmed after placemet. K KE-3020V Placemet head: multi-ozzle laser head (6 ozzles) high-precisio head (1 ozzle) Placemet rate (max.): 17,100 cph laser ceterig (IPC 9850) 2,400 cph visio ceterig 9,470 cph visio ceterig (MNVC) Compoet rage: x 74 mm or 50 x 150 mm Compoet height (max.): 25 mm Placemet accuracy: ±50 µm (Cpk 1) laser ceterig ±30 µm visio ceterig Borad dimesio (max.): 610 x 560 mm 800 x 560 mm (with log board optio) Compoet data ca be programmed simply by typig approximate dimesios, type ad packagig iformatio. Accurate dimesios, umbers of leads ad lead pitch are measured ad programmed automatically by the machie. LNC60 Compoet release cofirmed after placemet. Tombstoe pick easily detected. Complicated programmig of odd-shaped compoets is made easier by followig step-by-step guidelies, reducig programmig sigificatly. High precisio ad quality with electroic feeders Electroic tape feeders (ETF series) Presece of compoet is moitored util just before placemet. Flexible visio teachig A motor-drive electroic feeder capable of feedig compoets reliability ad quickly. Simple settig of feeder pitch No tools are required to chage the feeder pitch. A cocept i compoet ceterig that is capable of o-the-fly ceterig of 6 compoets simultaeously. Optical source Ceter of rotatio Light-sesitive elemet Tagetial Lie Ceterig achieves both a wider compoet rage ad higher accuracy all at the same time.the LNC60 accurately measures the compoet s ceter, dimesios, ad agular correctio all i a sigle sweep.the optical desig has bee simplified to give higher reliability i a thier ad lighter package. Status is show o a LED display Before productio, electroic feeders commuicate with the mouter to verify cosistecy with the productio program: type of feeder ad feed pitch. Should there be ay discrepacy, the LED display flashes a warig.the LED display also alerts the operator of wrog feeder positio ad whe compoets are ruig low. Durig productio, the LED display shows the feederpositio. Automatic correctio of pick positio o feeder The variace of the positio from the ceter of each compoet is detected by the machie head whe ceterig.this iformatio is trasmitted to each electroic feeder.the feeder automatically adjusts the pick positio to icrease the chace of simultaeous pickig.

4 _20V_JASEU_EN_02.pdf :30:04 From high-speed, high-accuracy moutig dow to very small parts ultraflexible performace assures the best retur o ivestmet for ay applicatio Flexible board size The ad KE-3020V XL-size accepts larger size boards up to 610 x 560 mm. XL-size ((610 x 560 mm) Placemet head multi-ozzle laser head (6 Nozzles) Placemet rate (max.): 8,500 cph laser ceterig (IPC 9850) 18,500 9,000 cph visio ceterig (MNVC) Compoet rage: x 33.5 mm Compoet height (max.): 12 mm Placemet accuracy: ±50 µm (Cpk 1) laser ceterig ±40 µm visio ceterig (MNVC) Board dimesio (max.): 0 x 560 mm x 560 mm (with log board optio) C L-Wide size (510 x 360 mm) L-size (410 x 360 mm) mm Visio ceterig techology Feeder compatibility The ad KE-3020V is compatible with mechaical ad electroic feeders. Mechaical ad electrical feeder trolleys are completely iterchageable Exchage trolley for electroical feeder allowig compaies with previous geeratios of mechaical feeders to cotiue to get the most from their ivestmet. Exchage trolley for mechaical feeder High-precisio head or MNVC (Multi-Nozzle Visio Ceterig) optio Ceterig method ca be selected based o compoet type, shape, size ad material. Laser ceterig is used for high-speed placemet of smaller compoets.visio is used whe lead or back light ball ispectio is eeded or whe the ad side ad side recogitio compoet is too large for the laser. May ozzles are available for oddshaped compoets providig usurpassed compoet hadlig. ozzles for odd-shaped compoets Laser ceterig techology Easy operatio JUKI s LNC60 laser sesor for high-speed & high quality placemet Operator s setup checklist visio recogitio The fuctio assists operators i the preparatio of a ew productio. By simply followig a checklist of setup items 1. Automatic width adjustmet to 8. Productio program check, a operator ca be sure they have performed the ecessary steps ad see which have ot bee completed. The LNC60 laser sesor has the uique ability to ceter compoets from to 33.5 x 33.5 mm. From ultra-small, ultra-thi, chip-shaped parts to small QFPs, CSPs, BGAs, a wide rage of parts ca be precisely cetered by the laser recogitio system at high-speed. M Y CM MY Automatic compoet measuremet CY Compoet check fuctio improves placemet reliability CMY Sice the laser is mouted o the head, it ca be used to moitor the presece of compoets the etire time from pick to placemet. This is difficult to accomplish with vacuum detectio oly. The placemet reliability is also improved because the release of the compoet is cofirmed after placemet. K KE-3020V Placemet head: multi-ozzle laser head (6 ozzles) high-precisio head (1 ozzle) Placemet rate (max.): 17,100 cph laser ceterig (IPC 9850) 2,400 cph visio ceterig 9,470 cph visio ceterig (MNVC) Compoet rage: x 74 mm or 50 x 150 mm Compoet height (max.): 25 mm Placemet accuracy: ±50 µm (Cpk 1) laser ceterig ±30 µm visio ceterig Borad dimesio (max.): 610 x 560 mm 800 x 560 mm (with log board optio) Compoet data ca be programmed simply by typig approximate dimesios, type ad packagig iformatio. Accurate dimesios, umbers of leads ad lead pitch are measured ad programmed automatically by the machie. LNC60 Compoet release cofirmed after placemet. Tombstoe pick easily detected. Complicated programmig of odd-shaped compoets is made easier by followig step-by-step guidelies, reducig programmig sigificatly. High precisio ad quality with electroic feeders Electroic tape feeders (ETF series) Presece of compoet is moitored util just before placemet. Flexible visio teachig A motor-drive electroic feeder capable of feedig compoets reliability ad quickly. Simple settig of feeder pitch No tools are required to chage the feeder pitch. A cocept i compoet ceterig that is capable of o-the-fly ceterig of 6 compoets simultaeously. Optical source Ceter of rotatio Light-sesitive elemet Tagetial Lie Ceterig achieves both a wider compoet rage ad higher accuracy all at the same time.the LNC60 accurately measures the compoet s ceter, dimesios, ad agular correctio all i a sigle sweep.the optical desig has bee simplified to give higher reliability i a thier ad lighter package. Status is show o a LED display Before productio, electroic feeders commuicate with the mouter to verify cosistecy with the productio program: type of feeder ad feed pitch. Should there be ay discrepacy, the LED display flashes a warig.the LED display also alerts the operator of wrog feeder positio ad whe compoets are ruig low. Durig productio, the LED display shows the feederpositio. Automatic correctio of pick positio o feeder The variace of the positio from the ceter of each compoet is detected by the machie head whe ceterig.this iformatio is trasmitted to each electroic feeder.the feeder automatically adjusts the pick positio to icrease the chace of simultaeous pickig.

5 Selectio of available optios Mechaical feeders Tape feeders Stick feeders Bulk feeders ATF (splicig tape feeders) Electroic feeders Tape feeders Stick feeders MNVC (Multi-Nozzle Visio Ceterig) optio Visio ceterig by the multi-ozzle head early doubles the placemet rate for smaller compoets, icludig CSPs, BGAs ad smaller QFPs. Coplaarity Sesor Measures true complaarity for both leaded compoets ad BGAs, reducig the chace of a bad solder joit. Placemet force cotrol Usig a built-i load cell, the placemet force of each ozzle ca be measured ad cotrolled durig the placemet process.the placemet force ca be set idividually for every compoet. Compoet Verificatio System (CVS) Compoet verificatio measures the resistace, capacitace or polarity of each compoet before the start of productio or after replacig the compoets. This optio prevets placemet of icorrect compoets. The ew ispectio uit features simultaeous measuremet of six compoets, reducig chageover time. Flex Calibratio System (FCS) JUKI s highly regarded easy maiteace just got eve easier! The optioal FCS calibratio jig is a simple to use system to re-calibrate placemet accuracy. The machie automatically picks ad places jig compoets, the measures the error ad adjusts all ecessary calibratios. Fluxer The fluxer is a device to apply flux or dippable solder paste to CSP ad flip chip compoet before placemet. The liear fluxer uses a precise cavity to esure the proper depth of flux. Offset placemet after solder scree pritig Offset Placemet After Solder Screepritig is a system to offset placemets to correct for solder paste misaligmet, which promotes the self-aligmet effect ad reduces the defect rate. Log board (800 x 560 mm) (800 x 360 mm) The log board optio allows to exted the possible board size of the KE-3020V / (L-size) from stadard 410 x 360 mm to 800 x 360 mm ad the KE-3020V / (XL-size) from stadard 610 x 460 mm to 800 x 560 mm. Selectio of tray feed devices Matrix Tray Server (rear type) Dual Tray Server Matrix Tray Holder I additio to the matrix tray server, a shuffle-type side mouted matrix tray chager is available. Note dual tray server or matrix tray holder for mechaical feeder baks is ot compatible with dual tray server or matrix tray holder for electrical feeder baks. Dual tray server, matrix tray server ad matrix tray chager for electrical feeder bak are specially desiged for use with the KE-3020V oly. Other model matrix tray servers ad matrix tray chagers will ot work with KE-3020V. Please refer to the product specificatios for details.

6 Specificatios Item Board size Log board * 1) Compoet height Compoet size Placemet speed Placemet accuracy Feeder iputs Power supply Apparet power Operatig air pressure Air cosumptio L-size L-Wide size 1) XL-size L-size / L-Wide size XL-size 6 mm 12 mm 20 mm 25 mm (XL -size oly) Laser recogitio Visio recogitio (stadard camera) (high resolutio camera) Chip (IPC9850) IC Model Laser recogitio Visio recogitio L / XL Machie L-size dimesios L-Wide size 1) (WxDxH) * 2) XL-size Mass L-size (approximately) XL-size 1) L-Wide size ad log board are optioal. 2) Dimesios of machie described are for coveyor height 950 mm. 3) With MNVC. MNVC is optioal o the ad stadard o the KE-3020V. 4) : With high resolutio camera ad MNVC. (optioal). KE-3020V: With high resolutio camera (optioal). 5) The display is ot part of the metioed height. ( mm) ( mm) ( mm) (800 / mm) ( mm) to 33.5 x 33.5 mm KE-3020VL / KE-3020VXL 3 mm 3) to 33.5 x 33.5 mm 3 mm to 74 x 74 mm or 50 x 150 mm 1 x 0.5 mm 4) to 20 x 20 mm 1 x 0.5 mm to 48 x 48 mm or 24 x 72 mm 18,500 cph 17,100 cph 9,000 cph cph 9,470 cph ±50 µm (Cpk 1) ±40 µm ±30 µm (±40 µm ) max. 160 (electroic 8 mm double tape feeder) 200 to 415 VAC, 3-phase 3 kva 0.5 ±0.05 Mpa 50 l/mi 1,500 1,690 1,500 mm 1,800 1,690 1,500 mm 2,131 1,890 1,500 mm 1,900 kg 2,250 kg A leadig supplier JUKI is oe of the leadig worldwide suppliers for SMT assembly systems. Our iovative ad reliable customer solutios are developed to meet customers' idividual demads ad are desiged to give Lowest Cost of Owership. With this philosophy JUKI strives to reach the highest stadard of customer satisfactio. Our uderstadig of Lowest Cost of Owership Ofte whe decidig o the purchase of a ew placemet system, oly the iitial ivestmet cost ad the theoretical placemet rate are cosidered. This overlooks may other factors that make up the overall productio cost; cosumables, spare parts ad service ca also be a big cost factor. Such thigs as chageover times, machie breakdows ad the differece betwee the theoretical ad actual throughput rate sigificatly affect productivity. Maiteace, programmig ad operator traiig accout for additioal persoel cost. Thaks to our may years of experiece buildig flexible modular placemet systems JUKI has gaied a outstadig reputatio. Data from the market has show that, compared to systems from other maufacturers, JUKI clearly provides the highest reliability ad lowest cost of owership i the idustry. Selectio of available optios Recogitio system Ispectio fuctio Coveyor Others Software Compoet hadlig ad feeders *1) EUROPE Headquarters Solothur, Switzerlad Telephoe Nuremberg, Germay Telephoe Gatwick, Eglad Telephoe +44 (0) AMERICA Headquarters Morrisville, NC Telephoe +1 (919) ASIA Juki Corporatio Tokyo, Japa Telephoe Multi-ozzle visio ceterig (MNVC) / Bad mark reader / High-resolutio camera (HRC) Coplaarity sesor / Compoet verificatio system (CVS) / SOT directio check fuctio Automatic board width adjustmet (AWA) Flex calibratio system (FCS) jig / Feeder positio idicator (FPI) / Placemet force cotrol / Fluxer uit / Offset placemet after solder screepritig / Blue light kit Itelliget shopfloor solutios (IS) / Itelliget feeder system (IFS-NX) / Exteral programmig uit (EPU) / CircuitCAM Express / Ativirus Matrix tray server TR-5 / Matrix tray chager TR-6 / High-speed Matrix Tray Server TR-7 /Matrix tray holder / Dual tray server TR-1 / Tape feeder / Bulk feeder * 2) / Stick feeder (SF/SW/ MBF 2) ) / ATF (spliceable tape feeder) / Feeder trolley / IC collectio belt / Trash box / Tape cutter * 3) 1) Compoet supply uits are differet either by mechaical or electric feeder bak. Make sure correct compoet supply uit be selected. 2) For mechaical bak oly. 3) For electric feeder trolleys oly. * Please refer to the product specificatios for details. Please cotact our headquarters or your earest JUKI sales office for further iformatio or alteratively visit our website: MEMBER ASSOCIA TION CONNECTING ELECTRONICS INDUSTRIES The specificatios are subject to chage without prior otice. Copyright 2013 JUKI Corporatio. All rights are reserved. Dec.-2011/Rev.00